Beijing Jingyi Jingwei Technology Co., Ltd. is a joint - stock company established through the overall transformation of Beijing Shuoke Jingwei Microelectronics Equipment Co., Ltd. (Shuoke Jingwei). It was registered and established in Beijing Economic - Technological Development Area on September 23, 2019, with a registered capital of 166.46135 million RMB. It is a national high - tech enterprise. Focusing on the core business of CMP, the core equipment for integrated circuits, it addresses the technological and operational shortcomings that need to be overcome in the process of industrialization and marketization. It continuously promotes the R & D and industrialization of CMP equipment, strengthens capacity building, constructs an operational development system, and consolidates its core competitiveness. We firmly believe that with the support of all parties, the company will surely explore a path that is more conducive to its development and more in line with the industry's development laws in aspects such as strengthening the development of its main responsibilities and core businesses, establishing a modern corporate system, building a talent development platform, and consolidating the management foundation. It will continuously stimulate the enthusiasm and creativity of employees, create greater value for shareholders, and create a happier and more dignified life for employees!
Core products
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6/8 inch CMP equipment - Horizon - T
Compatible with 6/8-inch wafers, fully automatic dry-in and dry-out, flexible process switching, wide applicability. Supports the planarization process requirements of third-generation semiconductors such as SiC and GaN and special materials. Achieved mass sales in the domestic market.
The main framework consists of four grinding heads, three grinding tables, and vertical cleaning. It integrates a variety of advanced endpoint detection technologies and a fully automatic process control system, meeting the requirements of CMP processes at 28nm and above in 12 - inch integrated circuit manufacturing. It has a mature architecture with obvious cost - advantage in production line operation.
2*2 dual-channel parallel process platform, with wide process applicability and high production efficiency. Real-time endpoint detection and intelligent process control system, advanced cleaning architecture. It can be widely applied in the manufacturing processes of integrated circuits, advanced packaging, large silicon wafers, etc. Currently, it has been applied in multiple international mainstream production lines of 28nm and above.
Work hard and achieve results. Four grinding heads and three grinding tables integrate a variety of advanced endpoint detection technologies and a fully automatic process control system, meeting all the complex planarization process requirements in 8 - inch IC manufacturing. Mass sales have been achieved both at home and abroad.
The On site service team provides on-site technical support. The R&D team collaborates with clients for simulation testing, new feature development, and more.